Visual Inspection - Wire Bonding


Wire bonding is an electrical interconnection technique using thin wire and a combination of heat, pressure and/or ultrasonic energy. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding process begins by firmly attaching the backside of a chip to a chip carrier using either an organic conductive adhesive or a solder.

Bondwires usually consist of aluminum, copper, silver or gold. Wire diameters start at 15 µm and can be up to several hundred micrometres for high-powered applications. Wire bonding failures, including non-stick on die pad (bond-off) and smash ball of the first bond, are often encountered in manufacturing of miniaturized packages with increased feature density and higher UPH requirement. 

Dino-Lite digital microscope cameras are perfect for wire bonding inspection. The ability to easily inspect, view and capture images or video of objects as well as perform comparisons or measurements, makes Dino-Lite an essential tool for inspection. Here are some Dino-Lite Microscope recommended for wire bonding :


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