Failure Analysis – PCB Board

Failure analysis is the process of collecting and analyzing data to determine the cause of a failure, often with the goal of determining corrective actions or liability. The failure analysis process relies on collecting failed components for subsequent examination of the cause or causes of failure using a wide array of methods, especially microscopy.

Optical microscopy may be one of the most popular and preferred testing methods used for detecting faults, defects and problems associated with soldering and assembly. Many customers choose optical microscopy because of its speed and accuracy. Microscopy testing can verify improper construction, which can lead to stresses that can expose flaws at certain cross sections.

Dino-Lite has been used increasingly for failure analysis in the microelectronics industry, especially for printed circuit boards (PCBs). Digital microscopes are practical to use and allow an efficient workflow for inspection.